A couple of months ago, I replaced the H4 headlight bulb in my PD with a super bright Cree LED. the result when compared to the shitty OEM halogen (even with a 70 series blue bulb) was amazing. The PD has a rectangular headlight which, compared to the 7 inch round that appeared on the /6 in 1973 is just crap. The various HID and LED set ups have improved over the years and they give enough light to make the PD ride able on a dark road, at night, I have a 6 inch 12 LED light bar under the head light and a 6 inch old Hella spot light on the left hand crash bar (all are relayed). I replaced the bulb in the Hella spot with a H2 (from memory) hi output LED...the combined result is just fantastic....way over the top for most riders, but for me, riding on kangaroo infested country roads at night (with no moon: black as sin) this upgrade has been the best thing. Anyway, two nights ago I went to go home from the hangar, the head light just stopped....fan was on, light bar and spot light on when hi beam was selected..just shit self. I took it out next day, tried it on the bench, NOUGHT! I contacted the supplier in Melbourne sent some pix with some other detail, not a problem! Replacement in the mail today. Cree and Phillips make the best LED's (apparently) and these were Cree's. I can source from China, but the cost is only a few dollars more from the Australian distributor in Melbourne...and for service like this , worth every penny.
When I was talking to him today, Maxwell told me about a new LED product that is about to come on line in the next month or so: 4 chip with flip chip technology...
I got this from Wikipedia : From what Maxwell told me today, these new "bulbs" are arranged in such a way that they emit light through 360 degrees (like a conventional bulb), are thinner, more stable and emit less heat. I'll keep you posted...keep an eye on the BOXERWORKS facebook page as well. These pix are of the current "best you can buy stuff. the new gear comes in 6 to 8 weeks...great prices and today I proved, a really goo warranty back up.
Side-view schematic of a typical flip chip mounting
Processing a flip chip is similar to conventional IC fabrication, with a few additional steps. Near the end of the manufacturing process, the attachment pads are metalized to make them more receptive to solder. This typically consists of several treatments. A small dot of solder is then deposited on each metalized pad. The chips are then cut out of the wafer as normal.
To attach the flip chip into a circuit, the chip is inverted to bring the solder dots down onto connectors on the underlying electronics orcircuit board. The solder is then re-melted to produce an electrical connection, typically using a Thermosonic bonding or alternativelyreflow solder process. This also leaves a small space between the chip's circuitry and the underlying mounting. In most cases an electrically-insulating adhesive is then "underfilled" to provide a stronger mechanical connection, provide a heat bridge, and to ensure the solder joints are not stressed due to differential heating of the chip and the rest of the system. The underfill distributes the thermal expansion mismatch between the chip and the board, preventing stress concentration in the solder joints which would lead to premature failure.
Recently, high-speed mounting methods evolved through a cooperation between Reel Service Ltd. and Siemens AG in the development of a high speed mounting tape known as 'MicroTape.'. By adding a tape-and-reel process into the assembly methodology, placement at high speed is possible, achieving a 99.90% pick rate and a placement rate of 21,000 cph (components per hour), using standard PCB assembly equipment.
The resulting completed flip chip assembly is much smaller than a traditional carrier-based system; the chip sits directly on the circuit board, and is much smaller than the carrier both in area and height. The short wires greatly reduce inductance, allowing higher-speed signals, and also conduct heat better.